ASTM F487-13(2018) PDF
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Дата публикации:
- 5 января 2024 г.
- SKU:
- ASTM F487-13(2018)
Abstract
AbstractThis specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, ...
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