ASTM STP15717S PDF
Measurement of Minority Carrier Recombination Lifetime in Silicon Wafers by Measurement of Photoconductivity Decay by Microwave Reflectance: Result of Round Robin Test
Название (английский):
ASTM STP15717S
Measurement of Minority Carrier Recombination Lifetime in Silicon Wafers by Measurement of Photoconductivity Decay by Microwave Reflectance: Result of Round Robin Test
- Статус документа:
- D
- Формат:
- Электронный (PDF)
- SKU:
- ASTM STP15717S
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Abstract
The round robin test was conducted, in order to check the deviation of lifetime errors by microwave photoconductive decay (µ -PCD) method. The samples were CZ thermally oxidized wafers of p- and n-type. Two resistivity values were set betw...
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