ASTM STP26047S PDF
Application of Total Reflection X-Ray Fluorescence Analysis for Metallic Trace Impurities on Silicon Wafer Surfaces
Название (английский):
ASTM STP26047S
Application of Total Reflection X-Ray Fluorescence Analysis for Metallic Trace Impurities on Silicon Wafer Surfaces
- Статус документа:
- D
- Формат:
- Электронный (PDF)
- SKU:
- ASTM STP26047S
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Abstract
Total Reflection X-Ray Fluorescence Analysis (TXRF) is presented as a new analytical tool which allows to assess the metal contamination on silicon wafer surfaces in a non-destructive way. The technique uses a conventional X-Ray tube with a...
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