BS EN 60068-2-20:2008 PDF

1   Scope and object This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191‑3 and IEC 61191‑4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.

NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance. See IEC 60068‑2‑54 (solder bath method) and IEC 60068‑2‑69 (solder bath and solder globule method for SMDs).