BS EN 60068-2-83:2011 PDF
Environmental testing - Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Environmental testing - Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 ноября 2011 г.
- ICS:
- 19.040
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60068-2-83:2011
Abstract
What is BS EN 60068-2-83 - Wettability of electronic components used in surface mounting devices (SMD) about?
BS EN 60068-2-83 is the second part of an international standard used for environmental testing that specifies the test method for evaluating the wettability of electronic components used in surface mounting devices (SMD). BS EN 60068-2-83 you can manufacture good quality electronic components used in surface mounting devices (SMD). BS EN 60068-2-83 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
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