BS EN 60191-6-17:2011 PDF
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid…
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid…
- Статус документа:
- D
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 июня 2011 г.
- ICS:
- 01.100.25
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-17:2011
Abstract
What is BS EN 60191-6-17 - Guidelines for packing surface mounted semiconductor devices about?
BS EN 60191-6-17 is the sixth part of an international standard used for semiconductor devices. BS EN 60191-6-17 can be your best guide in packing these surface mounted devices which help in avoiding defects and failure in these devices that take place while transporting, storing, and handling. BS EN 60191-6-17 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Who is BS EN 60191-6-...
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