BS EN 60191-6-19:2010 PDF
Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 июня 2010 г.
- ICS:
- 31.080.01
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-19:2010
Abstract
What is BS EN 60191-6-19 - Measurement methods of the package warpage used in semiconductor devices about?
BS EN 60191-6-19 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices. BS EN 60191-6-19 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array (BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
Who is BS EN 60191-6-19 -
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