BS EN 60191-6-21:2010 PDF
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
- Статус документа:
- D
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 декабря 2010 г.
- ICS:
- 25.040.40
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-21:2010
Abstract
What is BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP) about?
BS EN 60191-6-21 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices. BS EN 60191-6-21 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance with IEC 60191-4.
Who is BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP) for?
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