BS EN 60191-6-22:2013 PDF
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon…
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon…
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 апреля 2013 г.
- ICS:
- 31.080.01
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-22:2013
Abstract
What is BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages about?
BS EN 60191-6-22 is the sixth part of a multi-series standard used for the mechanical standardization of semiconductor devices. This helps in designing and manufacturing good quality surface mounted semiconductor device packages. BS EN 60191-6-22 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Who is BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages for?
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