BS EN 60191-6-4:2003 PDF
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 4 августа 2003 г.
- ICS:
- 31.080.01
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-4:2003