BS EN 60191-6-8:2001 PDF
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
- Статус документа:
- D
- Формат:
- Электронный (PDF)
- Дата публикации:
- 16 ноября 2001 г.
- ICS:
- 01.100.25
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-8:2001
Abstract
What is BS EN 60191-6-8 - Outline drawings of surface mounted semiconductor device packages about?
BS EN 60191-6-8 is the sixth part of a multi-series standard used for the mechanical standardization of semiconductor devices. This helps in designing and manufacturing good quality surface mounted semiconductor device packages. BS EN 60191-6-8 provides the common outline drawings and dimensions for all types of structures and is composed of materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain the interchangeability of G-QFP.
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