BS EN 60749-20-1:2009 PDF

What is BS EN 60749-20-1 – Handling, packaging, labelling procedures for semiconductors about?

BS EN 60749-20-1 is an international standard that focuses on mechanical and climatic tests with handling, packaging, labelling and shipping of semiconductor devices. BS EN 60749-20-1 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. BS EN 60749-20-1 specifies the handling conditions for SMDs subjected to the above test conditions. Two test conditions, method A and method B are specified in the soldering heat test of IEC 60749-20. For method A, moisture soak conditions are specified on the assumption that moisture content inside the moisture barrier bag is less than 30 % RH. For method B, moisture soaking conditions are specified on the assumption that the manufacturer’s exposure time (MET) does not exceed 24 h and the moisture content inside the moisture barrier bag is less than 10 % RH. Note: Hermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling.

Who is BS EN 60749-20-1 - Handling, packaging, labelling procedures for semiconductors for