BS EN 61188-5-8:2008 PDF
Printed boards and printed board assemblies. Design and use - Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
Printed boards and printed board assemblies. Design and use - Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 мая 2008 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN 61188-5-8:2008
Abstract
What is BS EN 61188-5-8 – Attachment considerations for printed boards about?
BS EN 61188-5-8 is an international standard that focuses on printed board assemblies and attachment methods for electronic components. BS EN 61188-5-8 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns, or protective coated lands. BS EN 61188-5-8 specifies the technical specification such as general information, BGA(square) field of applications, component dimensions, solder joint fillet design, land pattern design, FBGA(square), BGA(rectangular), etc., for area array components (BGA, FBGA, CGA, LGA).
Who is BS EN 61188-5-8 – Attachment considerations for printed boards for ?
BS EN 61188-5-8 on attachment considerations for printed boards is useful for:
Manufacturers of printed circuit boards (PCBs) Manufacturers of electronic components and interconnecting structures Manufacturers and suppliers of laminate sheets Quality control and testing personnel Regulat...
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