BS EN 61189-5-2:2015 PDF

What is BS IEC 61189-5-2 - Soldering flux for printed board assemblies about?

BS EN IEC 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. electrical materials printed board and other interconnection structures and assemblies  are a laminated sandwich structure of conductive and insulating layers. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures. BS IEC 61189-5-2 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions.�...