BS EN 61189-5-3:2015 PDF
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste for printed board assemblies
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste for printed board assemblies
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 января 2015 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN 61189-5-3:2015
Abstract
What is BS EN 61189-5-3 - Soldering paste for printed board assemblies about? BS EN 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the EN 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures. BS EN 61189-5-3 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions. BS EN 61189-5-3 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. BS EN 61189-5-3 focuses on test methods for soldering paste based on the existing EN 61189-5 and EN 61189-6 . In addition, it includes test methods of soldering paste for lead-free soldering.
Похожие стандарты
Другие стандарты BS