BS EN 61189-5-4:2015 PDF
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 января 2015 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN 61189-5-4:2015
Abstract
What is BS EN 61189-5-4 - T est methods for materials and assemblies about?
Printed board assemblies are used in almost every electronic product to mechanically support and electrically connect electronic components. BS EN 61189-5-4 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. BS EN 61189-5-4 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6 . In ...
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