BS EN 61189-6:2006 PDF
Test methods for electrical materials, interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies
Test methods for electrical materials, interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 29 сентября 2006 г.
- ICS:
- 29.060.10
- Технический комитет:
- CENELEC
- SKU:
- BS EN 61189-6:2006
Abstract
What is BS EN 61189-6 – Material testing for electronic assemblies about?
The IEC 61189 series covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies as well as related materials or component robustness, irrespective of their method of manufacture . The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures. BS EN 61189-6 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblie...
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