BS EN 61191-2:2017 PDF
Printed board assemblies - Sectional specification. Requirements for surface mount soldered assemblies
Printed board assemblies - Sectional specification. Requirements for surface mount soldered assemblies
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 октября 2019 г.
- ICS:
- 31.190
- Технический комитет:
- CENELEC
- SKU:
- BS EN 61191-2:2017
Abstract
1 Scope This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
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