BS EN 62047-13:2012 PDF
Semiconductor devices. Micro-electromechanical devices - Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices - Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 мая 2012 г.
- ICS:
- 31.080.99
- Технический комитет:
- CENELEC
- SKU:
- BS EN 62047-13:2012
Abstract
What is BS EN 62047-13 - Adhesive strength used in micro-electromechanical structure about?
BS EN 62047-13 is the 13th part of an international standard used for Micro-electromechanical devices. BS EN 62047-13 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively.
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