BS EN 62047-25:2016 PDF
Semiconductor devices. Micro-electromechanical devices - Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
Semiconductor devices. Micro-electromechanical devices - Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 ноября 2016 г.
- ICS:
- 31.080.99
- Технический комитет:
- CENELEC
- SKU:
- BS EN 62047-25:2016
Abstract
What is BS EN 62047-25 - Silicon-based MEMS fabrication technology ?
BS EN 62047-25 is the 25th part of an international standard used for semiconductor devices. This test method helps in measuring the interfacial adhesion energy in microelectromechanical devices. BS EN 62047-25 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based microelectromechanical system (MEMS). BS EN 62047-25 is applicable to the in-situ pull-press and shearing strength measurement of the micr...
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