BS EN IEC 61189-3-302:2025 PDF

Name: BS EN IEC 61189-3-302:2025 — Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
SKU: BS EN IEC 61189-3-302:2025
Price: 50 EUR
Availability: InStock

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Название (английский):

BS EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Статус документа:: Действующий
Формат:: Электронный (PDF)
Дата публикации:: 30 ноября 2025 г.
ICS:: 31.180
Технический комитет:: CENELEC
SKU:: BS EN IEC 61189-3-302:2025

Тип поставки:

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Язык документа:

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Срок поставки:1 раб. дн. (перевод)

Цена:50 €

BS EN IEC 61189-3-302:2025 PDF

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