BS IEC 63011-2:2018 PDF
Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect
Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 января 2019 г.
- ICS:
- 31.200
- Технический комитет:
- CENELEC
- SKU:
- BS IEC 63011-2:2018
Abstract
What is BS IEC 63011-2 about?
BS IEC 63011-2 is the second part of the BS IEC 63011 series of standards that provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. Note: These specifications apply only if the electrical coupling method of die-to-die alignment is used in the die stacking.
Who is BS IEC 63011-2 for?
BS IEC 63011-2 on stack dies is useful for:
Integrated circuits manufacturers
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