ASTM F3139-15(2023)
Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry (Withdrawn 2026)
Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry (Withdrawn 2026)
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Дата публикации:
- 24 февраля 2026 г.
- SKU:
- ASTM F3139-15(2023)
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Abstract
Significance and Use 4.1 Tin-based solder alloys are commonly used to manufacture electrical and electronic goods. The elements lead, cadmium, mercury, antimony and bismuth are often declarable substances in solder materials. This test met...
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