BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 сентября 2020 г.
- ICS:
- 31.080.01
- SKU:
- BS EN IEC 60749-15:2020
Abstract
What is BS EN IEC 60749 ‑ 15 about?
BS EN IEC 60749 ‑ 15 is the 15th part of Semiconductor devices in multi-series.
BS EN IEC 60749 ‑ 15 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which <span data-mce-fragment="1" data-ccp-props='{"134233279":true,"201341983":0,"335559739":160,"3355...
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