BS EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 декабря 2023 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-2-801:2023
Abstract
1 Scope This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
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