BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 декабря 2023 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-2-804:2023
Abstract
1 Scope
This part of [IEC 61189](/search?q=IEC%C2%A061189)
specifies a test method to determine the time to delamination of base materials and
printed boards using a thermomechanical analyser (TMA). Temperatures used for this
evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
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