BS EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - X/Y CTE test for thin base materials by TMA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - X/Y CTE test for thin base materials by TMA
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 мая 2024 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-2-805:2024
Abstract
1 Scope
This part of [IEC 61189](/search?q=IEC%C2%A061189)
defines the method to be followed for the determination of the X/Y coefficient of
thermal expansion of thin electrical insulating materials via the use of a thermomechanical
analyser (TMA). This method is applicable to materials that are solid for the entire
range of temperature used, and that retain sufficient rigidity over the temperature
range so that so that irreversible indentation of the specimen by the sensing probe
does not occur.
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