BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 ноября 2021 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-2-807:2021
Abstract
1 Scope This part of IEC 61189 specifies a test method to determine the decomposition temperature ( T d ) of base laminate materials using thermogravimetric analysis (TGA).
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