BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 июня 2024 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-2-808:2024
Abstract
1 Scope
This part of [IEC 61189](/search?q=IEC%C2%A061189)
describes the thermal transient method to characterize the thermal resistance of
an assembly consisting of a heat source (e.g. power device), an attachment material
(e.g. solder) and a dielectric layer with electrode. This method is suitable to determine
the thermal resistance of materials and assembly methods as well as to optimize the
thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance
of a dielectric material. For that purpose, other standards exist. Examples are given
in Annex A.
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