BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste using fine solder particles
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste using fine solder particles
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 мая 2021 г.
- ICS:
- 31.180
- SKU:
- BS EN IEC 61189-5-301:2021
Abstract
What is BS EN IEC 61189 ‑ 5 ‑ 301 about?
BS EN IEC 61189 ‑ 5 ‑ 301 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less). <...
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