BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2021 г.
- ICS:
- 31.180
- SKU:
- BS EN IEC 61189-5-502:2021
Abstract
What is BS EN IEC 61189 ‑ 5 ‑ 502 about?
BS EN IEC 61189 ‑ 5 ‑ 502 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.
An assembly process involves several different process materials including solder flux, solder paste, solder wire, underfill materials, adhesives, staking ...
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