BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2021 г.
- ICS:
- 19.080
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-5-601:2021
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