BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2018 г.
- ICS:
- 31.190
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61190-1-3:2018
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