BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
Название (английский):
BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 июня 2023 г.
- ICS:
- 29.035.10
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61249-2-51:2023
Тип поставки:
Язык документа:
Срок поставки:1 рабочий день
Цена:50 €
Abstract
1 Scope
This part of [IEC 61249](/search?q=IEC%C2%A061249)
specifies the construction, materials, property requirements, quality assurance,
packaging, marking, storage of base materials for integrated circuit card carrier
tape, unclad (hereinafter referred to as IC carrier tape base materials ).
This document is applicable to IC carrier tape base materials , which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer,
and the other side is coated with adhesive and protected by release film.
Похожие стандарты
Упомянутые в описании и другие стандарты BS