BS EN IEC 61760-3:2021
Surface mounting technology - Standard method for the specification of components for through-hole reflow (THR) soldering
Surface mounting technology - Standard method for the specification of components for through-hole reflow (THR) soldering
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2021 г.
- ICS:
- 31.190
- SKU:
- BS EN IEC 61760-3:2021
Abstract
What is BS EN IEC 61760 ‑ 3 about?
BS EN IEC 61760 ‑ 3 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
Furthermore, BS EN IEC 61760 ‑ ...
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