BS EN IEC 63215-2:2023
Endurance test methods for die attach materials - Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Endurance test methods for die attach materials - Temperature cycling test method for die attach materials applied to discrete type power electronic devices
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 декабря 2023 г.
- ICS:
- 31.190
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 63215-2:2023
Abstract
1 Scope
This part of [IEC 63215](/search?q=IEC%C2%A063215)
applies to the die attach materials and joining system applied to discrete type power
electronic devices.
This document specifies the temperature cycling test method which takes into account
the actual usage conditions of discrete type power electronic devices to evaluate
reliability of the die attach joint materials and joining system, and establishes
a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor
devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee
the reliability of the power semiconductor device packages.
NOTE The test result obtained using this document will not be used as absolute quantitative
data, but for intercomparison with the other die attach materials results using the
same setup.
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