BS IEC 62047-37:2020
Semiconductor devices. Micro-electromechanical devices - Environmental test methods of MEMS piezoelectric thin films for sensor application
Название (английский):
BS IEC 62047-37:2020
Semiconductor devices. Micro-electromechanical devices - Environmental test methods of MEMS piezoelectric thin films for sensor application
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 апреля 2023 г.
- ICS:
- 31.080.01
- SKU:
- BS IEC 62047-37:2020
Тип поставки:
Язык документа:
Срок поставки:1 рабочий день
Цена:50 €
Abstract
1 Scope
This part of [IEC 62047](/search?q=IEC%C2%A062047)
specifies test methods for evaluating the durability of MEMS piezoelectric thin film
materials under the environmental stress of temperature and humidity and under mechanical
stress and strain, and test conditions for appropriate quality assessment. Specifically,
this document specifies test methods and test conditions for measuring the durability
of a DUT under temperature and humidity conditions and applied voltages. It further
applies to evaluations of direct piezoelectric properties in piezoelectric thin films
formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic
sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting
the lifetime of a piezoelectric thin film based on a Weibull distribution.
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