IEC 60115-4:2022
Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 113
- Дата публикации:
- 29 ноября 2022 г.
- Издание:
- IEC IS 60115 edition 3 version 1
- ICS:
- 31.040.10
IEC 60115-4:2022 relates to resistors having a rated dissipation typically greater than 1 W up to and including 1 000 W for use in electronic equipment. This document is applicable to fixed power resistors with a maximum surface temperature (MET) higher than the preferred upper category temperature (UCT) of 200 °C. NOTE Heat sink resistors, i.e. resistors which in their operation depend on being mounted on a dedicated heat sink, owing to their special temperature conditions, are covered by a special sectional specification (under consideration at the time of publication). These resistors are typically described according to types (different geometric shapes) and styles (different dimensions), and product technology. The object of this document is to define preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. NOTE SMD resistors are covered by IEC 60115-8, regardless of their dissipation. This edition includes the following significant technical changes with respect to the previous edition: the definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted; a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2; the 'period-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been adopted as default test method in 5.3.9, thereby replacing the legacy test 'periodic-pulse overload test of IEC 60115-1:2020, 8.4; the revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.22 and 5.3.23; the combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.25; the 'endurance at room temperature test' of IEC 60115-1:2020, 7.2 has been reworked and adopted in 5.3.5; the 'single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.8, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.1. climatic tests for 'operation at low temperature' of IEC 60115 1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional tests in 5.4.5. and 5.4.6, respectively; inclusion of an optional flammability test as 5.4.8; new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations; acceptance criteria for the visual inspection have been added in 6.5 and in Annex B; visual inspection for the primary and proximity packaging has been added in 6.5.3 and in 7.2; the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8; the revised test clause numbering of IEC 60115-1:2020 has been applied; a new Annex C has been added to summarize workmanship requirements for the assembly of leaded power resistors, e.g. as given in the prior IEC 61192 series of standards; the informative Annex F on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly; furthermore, the informative Annex X has been ad
Abstract
Overview
IEC 60115-4:2022 is the IEC sectional specification for fixed power resistors intended for through‑hole assembly on printed circuit boards (THT) or for assembly on chassis. It covers resistors with rated dissipation typically greater than 1 W up to and including 1 000 W, and specifically those with a maximum surface temperature (MET) above the preferred upper category temperature (UCT) of 200 °C. The standard defines preferred ratings and characteristics, selects applicable tests and measuring methods from IEC 60115‑1, and sets general performance and quality assessment requirements for high‑power fixed resistors.
Key topics and technical requirements
- Product types and styles: axial, radial, vertical, tubular, ceramic‑housed, metal‑housed wire‑wound and other geometric shapes and styles for THT or chassis mounting.
- Product technologies: metal film, metal glaze, metal oxide, wire‑wound, metal strip and other specified technologies.
- Ratings and limits: rated dissipation (P), limiting element voltage (Umax), insulation voltage and insulation resistance for power resistors.
- Temperature and stability: temperature coefficient of resistance (TCR), temperature rise, endurance at rated and room temperatures, and UCT‑based tests.
- Electrical overload tests: single‑pulse high‑voltage overload test (pulse shape 10/700 ms adopted; 1.2/50 ms optional) and periodic‑pulse high‑voltage overload test adopted as default.
- Reliability and environmental tests: solderability (lead‑free and SnPb revisions adopted), combined solvent resistance, climatic tests (optional low‑temperature and damp‑heat), vibration, shock, rapid temperature change, and optional flammability and ESD tests.
- Quality and inspection: visual inspection acceptance criteria, packaging and marking requirements, periodic evaluation of termination platings, workmanship guidance (new Annex C), and updated quality assessment procedures.
Practical applications and who uses this standard
IEC 60115‑4 is essential for:
- Resistor manufacturers specifying design, materials and test regimes for high‑power fixed resistors (THT and chassis mounted).
- Electronic component engineers and designers selecting power resistors for power supplies, motor drives, audio amplifiers, power conversion, load banks and industrial electronics.
- Test laboratories and QA teams implementing conformity testing, endurance and environmental verification per IEC methods.
- Purchasing and compliance teams defining procurement specifications and supplier conformance clauses.
- PCB and chassis assembly engineers needing guidance on mounting, solderability and mechanical robustness for through‑hole power resistors.
Related standards
- IEC 60115‑1 (generic specification and test procedures) - referenced heavily for test methods and classifications.
- IEC 60115‑8 - covers SMD resistors (regardless of dissipation).
- Prior workmanship guidance: IEC 61192 series (informative history referenced).
Keywords: IEC 60115‑4, power resistors, fixed resistors, THT, through‑hole resistors, chassis assembly, rated dissipation, temperature coefficient, solderability, high‑voltage overload test, wire‑wound, metal oxide.
Технические детали
- Технический комитет
- TC 40 - Capacitors and resistors for electronic equipment
- SKU
- IEC 60115-4:2022
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