IEC 60317-36:2013

Overview

IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire, class 180, with a dual coating. The wire uses an underlying polyesterimide enamel (which may be modified while retaining its chemical identity) plus a thermoplastic bonding layer to enable solderability and improved bonding. The standard covers manufacturing, dimensions, performance tests and acceptance criteria for solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer for nominal conductor diameters from 0.020 mm up to and including 1.600 mm (Grades 1B and 2B).

Key topics and requirements

• Thermal class: Class 180 (temperature index 180); minimum heat shock temperature of 200 °C.
• Dual coating composition: Polyesterimide base enamel + thermoplastic bonding layer for solderability and heat/solvent bonding.
• Conductor diameter range: Grade 1B and Grade 2B both cover 0.020 mm to 1.600 mm (nominal diameters per IEC 60317-0-1).
• Electrical & mechanical tests: Dimensions, electrical resistance, elongation, springiness, flexibility, adherence, heat shock, cut-through (no failure within 2 min at 265 °C), resistance to abrasion, solvents, breakdown voltage, continuity of insulation and dielectric dissipation factor.
• Solderability: Consolidated solderability requirements covering small and larger diameters to ensure reliable solder joints.
• Bonding tests: Heat and solvent bonding strength tests for helical and twisted coils.
• New/updated tests: Addition of Clause 23 - Pin hole test, consolidation of solderability clauses and clarifications to normative references in the 2nd edition and later amendments.
• Normative references: Used in conjunction with IEC 60317-0-1:2013 (general requirements for enamelled round copper wire) and related test-method standards.

Applications

• Selection and specification of high-temperature winding wire for motors, transformers, inductors, solenoids and other electrical windings requiring reliable solderability at elevated temperatures.
• Use where a bonding layer is required for automated winding, impregnation, or mechanical stabilization.
• Environments requiring class 180 thermal performance (e.g., industrial drives, power electronics, HVAC compressors, traction and aerospace applications where higher temperature endurance is needed).

Who uses this standard

• Wire manufacturers and formulators of enamel and bonding layers.
• Motor, transformer and coil designers and OEMs specifying wire performance for thermal class 180.
• Quality, test and compliance engineers in manufacturing and test laboratories.
• Procurement and regulatory teams ensuring international conformity and interchangeability in global supply chains.

Related standards (brief)

• IEC 60317-0-1:2013 - General requirements for enamelled round copper wire (normative).
• IEC 60851 series - Test methods for winding wires.
• IEC 60264 - Packaging of winding wires.

This standard ensures consistent, internationally recognized performance criteria for solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer, supporting reliable high-temperature winding applications and global supply compatibility.