IEC 60749-37:2008

Overview

IEC 60749-37:2008 is an international standard published by the International Electrotechnical Commission (IEC) that defines a board level drop test method for surface-mount semiconductor devices using an accelerometer. This test method is designed to evaluate and compare the drop performance of surface-mount electronic components commonly used in handheld electronic products. By standardizing the test board, test setups, and procedures, IEC 60749-37 aims to ensure reproducibility and consistency in the assessment of mechanical robustness during drop events.

The standard focuses specifically on the drop performance related to excessive flexure of printed circuit boards (PCBs) that can lead to electronic or mechanical failures in compact, portable devices. It does not cover drop tests simulating shipping and handling shocks, nor does it replace full system-level qualification tests.

Key Topics

• Purpose and Scope

  • Evaluates the vulnerability of surface-mount components to drop-induced failures.
  • Assesses failure modes similar to those experienced during real-world use in handheld electronics.
  • Provides a reproducible and comparable method for manufacturers and test labs.

• Test Apparatus and Setup

  • Utilizes a standardized shock-testing apparatus capable of delivering specified acceleration and shock pulse duration.
  • Employs accelerometers to accurately measure mechanical shock experienced by the PCB and mounted components.

• Test Board Requirements

  • Outlines preferred construction, layout, and materials for test boards representative of actual handheld electronics.
  • Specifies mounting schemes and assembly inspections for quality assurance.

• Component and Sample Handling

  • Details configurations for mounting 1, 5, or 15 components per board, covering worst-case and typical placement scenarios.
  • Recommends sample sizes sufficient for meaningful comparative analysis.

• Drop Test Procedure

  • Describes pre-test preparation, including board and component inspection.
  • Provides guidance on parameter characterization and in-situ electrical event monitoring during drop tests.

• Failure Criteria and Analysis

  • Defines electrical and physical criteria for determining component failure.
  • Recommends post-test analysis to establish root cause and categorize failure mechanisms (component, interconnect, or board failures).

Applications

IEC 60749-37:2008 has practical importance in the consumer electronics and semiconductor manufacturing industries, particularly for devices subjected to accidental drops, such as:

• Mobile phones and smartphones
• Cameras and portable audio/video devices
• Calculators, pagers, PDAs, and other pocket-sized electronics
• PCMCIA cards and smart cards
• Other portable or wearable electronics

Key benefits and applications include:

• Component Reliability Assessment: Enables manufacturers to compare the mechanical robustness of various package types and board constructions in a controlled, repeatable manner.
• Quality Control: Offers a standard approach for qualifying new materials, designs, or manufacturing processes that may affect drop performance.
• Failure Diagnostics: Provides a foundation for investigating root causes of failures and implementing design improvements.
• Performance Benchmarking: Assists in establishing baselines for component and system reliability under mechanical stress typical of end-user handling.

Related Standards

For comprehensive testing and assessment, IEC 60749-37:2008 should be considered alongside other IEC standards, including:

• IEC 60749-10: Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock. Focuses on mechanical shock testing outside the scope of board-level drop performance.
• IEC 60749-20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat.
• IEC 60749-20-1 (future): Addresses handling, packing, labeling, and shipping of surface-mount devices sensitive to moisture and soldering heat.

IEC 60749-37 establishes a vital link between component-level evaluation and end-product reliability in the growing landscape of portable electronic devices. By employing this standard, manufacturers and test laboratories can ensure consistent, high-quality assessments and continuous improvement in product durability.

For the latest updates and supporting documents, always consult the IEC catalogue and related semiconductor device testing standards.