IEC 61760-1:2006

Overview

IEC 61760-1:2006 - "Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)" provides a reference framework for compiling component specifications for electronic parts intended for surface mount technology (SMT). The second edition (2006) updates requirements to address lead‑free soldering, expands scope to include components mounted by gluing, and links solderability and soldering‑heat requirements directly to IEC 60068‑2‑58. The standard defines process conditions, test conditions and essential component design and packaging requirements so a wide variety of SMDs can withstand common SMT assembly processes.

Key topics and requirements

• Component specification baseline: General rules for what must appear in an SMD component specification related to SMT assembly.
• Process reference conditions: Defined assembly steps and representative process conditions (e.g., reflow, vapour phase, double wave and wave soldering) and corresponding temperature/time profiles for terminals.
• Solderability and resistance to soldering heat: Requirements and tests referenced to IEC 60068‑2‑58 (solderability, metallization dissolution, soldering heat resistance).
• Lead‑free compatibility: Additional requirements and considerations for components to be compatible with lead‑free (RoHS) soldering processes.
• Mounting methods: Guidance for securing components prior to soldering, including pick‑and‑place handling, gluing processes and removal/replacement.
• Packaging and handling: Packaging formats for automatic handling (tape, trays, stick magazines, bulk), labelling, storage and transport considerations.
• Mechanical and reliability aspects: Coplanarity, terminal design, body seating stability, mechanical stress, body strength and component reliability assurance.
• Cleaning and solvent resistance: Typical cleaning conditions and resistance requirements where cleaning is used.
• Marking and traceability: Recommendations for component marking, orientation and identification to support automatic assembly.

Applications and users

IEC 61760‑1 is used by:

• Component manufacturers preparing SMD datasheets and design rules.
• PCB assembly and process engineers defining acceptable component families for given assembly lines.
• Quality, reliability and test laboratories creating component qualification plans.
• Procurement and design teams requiring component compatibility with lead‑free reflow, wave or adhesive mounting processes. Practical uses include verifying solderability, selecting packaging for automatic handling, specifying gluing and reflow compatibility, and ensuring consistent assembly yields.

Related standards

• IEC 60068 series (environmental testing), notably IEC 60068‑2‑58
• IEC 60286 series (packaging for automatic handling)
• IEC 60191‑6 (semiconductor package outlines)
• IEC 60749 (mechanical and climatic tests) These referenced documents provide the detailed test methods and packaging rules that support IEC 61760‑1.