IEC 61760-2:2021

Overview

IEC 61760-2:2021 is an IEC application guide that defines recommended transportation and storage conditions for surface mounting devices (SMDs). Its objective is to ensure SMDs - both active and passive - are received and stored so they can be processed (positioned, soldered) without degradation of quality or reliability. The standard focuses on environmental, mechanical and packaging considerations for SMD handling; printed circuit boards are explicitly excluded.

Key topics and technical requirements

• Climatic classifications: Transportation and storage climate conditions are referenced to IEC 60721 series. General transportation climate is aligned with IEC 60721-3-2 (class 2K12); storage with IEC 60721-3-1 (class 1K21).
• Specific limits called out:
  • Low air temperature down to −40 °C; typical temperature change example −40 °C to +30 °C.
  • Air pressure minima (e.g., 30 kPa) and rate of pressure change (e.g., 6 kPa/min).
  • Relative humidity range guidance (low 10 % to high 75 %); avoid condensation and dripping water.
  • Solar radiation guidance (table reference: 700 W/m²) - direct solar exposure should be avoided.
• Mechanical conditions: Transportation mechanical classes per IEC 60721-3-2 (e.g., 2M1 / 2M4) and guidance to prevent box deformation and direct transmission of forces to internal packaging.
• Time limits:
  • Prefer transportation time ≤ 10 days (time outside controlled storage).
  • Recommended storage time not to exceed two years (and preferably ≤ one year after customer receipt); requalification (at least solderability) required if exceeded.
• Packaging & dry-packing: Use appropriate packaging per IEC 60286 series (tape, magazines, trays, bulk) and consult IEC 61760-4, IEC 60749-20-1 or IPC/JEDEC J-STD-033 for dry-pack procedures and moisture control.
• Risks addressed: poor solderability, delamination, “popcorning”, solderability degradation and electrostatic/chemical exposures.

Practical applications

• Ensures components arrive and remain processable for automated surface-mount assembly lines.
• Guides selection of transport modes (conditioned air freight vs. rail/road) depending on SMD sensitivity.
• Informs incoming inspection, storage policies, shelf-life management, and supplier specifications.
• Reduces assembly failures caused by environmental or mechanical damage during logistics.

Who should use this standard

• Component manufacturers and packagers
• Electronics OEMs and contract manufacturers (CMs)
• Quality, logistics and supply-chain engineers handling SMD inventory
• Test and process engineers responsible for soldering qualification and requalification

Related standards

• IEC 60286-3/4/5/6 (packaging of SMDs)
• IEC 60721-3-1 / 60721-3-2 (environmental classification)
• IEC 60749 (semiconductor test methods)
• IEC 61760-4 (dry packing guidance)
• IEC/TS 61340-5-1 and IEC/TR 61340-5-2 (electrostatic protection)
• IPC/JEDEC J-STD-033 (moisture/dry-pack handling)

Keywords: IEC 61760-2:2021, SMD transportation, SMD storage, surface mounting devices, packaging, solderability, popcorning, environmental classification.