IEC 62047-36:2019

Overview

IEC 62047-36:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films" - defines standardized test methods and conditions for evaluating the durability of MEMS piezoelectric thin films under environmental (temperature and humidity) and electrical stress. The standard focuses on measuring changes in converse piezoelectric properties for thin films (actuator applications) primarily formed on silicon substrates. It excludes lifetime prediction methods (for example, Weibull-based reliability forecasting).

Key topics and technical requirements

• Scope of testing: Environmental and dielectric withstand tests to quantify degradation of DUTs (device under test) caused by temperature, humidity and applied voltages.
• Measurement baseline: Initial and final piezoelectric measurements must follow IEC 62047-30 measurement methods. Ambient measurement conditions specified (e.g., 25 °C ± 3 °C, RH 45–75 %, atmospheric pressure 86–106 kPa).
• Test types included:
  • High temperature bias test
  • High temperature and high humidity bias test (moist heat)
  • High/low temperature storage tests
  • High temperature & high humidity storage
  • Soldering heat (reflow) test
  • Temperature cycling
  • Dielectric withstand testing (electrical stress)
• Dielectric evaluation: Dielectric withstand is assessed by measuring leakage current under DC bias and observing breakdown behavior.
• Procedure flow: Initial measurements → environmental/electrical stress application (per prescribed conditions) → post treatment → final measurements to quantify degradation.
• Test setup guidance: Requirements for DUT placement, prevention of direct water contact, continuous operation vs storage modes, monitoring chamber conditions and test durations (selectable per standard tables).

Applications and who uses it

IEC 62047-36 is intended for:

• MEMS device manufacturers and thin‑film process engineers validating piezoelectric actuator materials (e.g., PZT, AlN)
• Quality assurance and qualification teams performing environmental and dielectric screening
• Test laboratories and component suppliers establishing standardized durability assessments
• Product designers assessing actuator performance under temperature/humidity and electrical stress

Practical benefits include consistent, comparable durability data for design validation, lot acceptance, supplier qualification and pre‑qualification for harsh-environment deployments.

Related standards

• IEC 62047-30 - Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (normative reference for measurement procedures)
• IEC 60068-2-14:2009 - Environmental testing - Test N: Change of temperature (referenced for temperature cycling conditions)
• The IEC 62047 series for broader MEMS piezoelectric measurement and test guidance

Keywords: IEC 62047-36:2019, MEMS piezoelectric thin films, dielectric withstand test, environmental testing, piezoelectric actuators, DUT testing, high temperature humidity testing.