IEC 62047-4:2008
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 38
- Дата публикации:
- 21 августа 2008 г.
- Издание:
- IEC IS 62047 edition 1 version 1
- ICS:
- 01
IEC 62047-4:2008 describes the generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. IEC 62047-4:2008 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.
Abstract
Overview
IEC 62047-4:2008, titled "Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS," is an international standard published by the International Electrotechnical Commission (IEC). This standard provides generic specifications and quality assessment procedures for micro-electromechanical systems (MEMS) primarily made from semiconductor materials. It establishes standardized principles for describing and testing key characteristics-electrical, optical, mechanical, and environmental-across various MEMS types, including sensors and RF MEMS, while explicitly excluding optical MEMS, bio MEMS, micro TAS, and power MEMS.
The IEC 62047-4:2008 standard serves as a foundational document that supports the development and harmonization of more specific MEMS standards, facilitating consistent material characterization, assembly, testing, and process control within the semiconductor and MEMS industries. While semiconductor-based MEMS devices are the principal focus, the standard's principles can also be applied to MEMS made from polymers, glass, metals, and ceramics.
Key Topics
- Generic MEMS Specifications: Defines universally applicable specifications for various semiconductor-based MEMS devices, forming a base for detailed application-specific standards.
- Quality Assessment Procedures: Outlines general principles for quality verification including eligibility for qualification, approval testing, environmental/climatic testing, endurance tests, and accelerated testing.
- Testing and Measurement: Describes methodologies for physical, mechanical, climatic, and electrical test methods under standardized environmental conditions.
- Material and Process Control: Covers essential elements involved in micromachining technologies such as silicon processing, photolithography, etching, vapor deposition, bonding, and assembly techniques.
- Device Identification and Traceability: Includes marking requirements for device identification, traceability, and packaging to support quality control and supply chain integrity.
- Standardized Terminology and Units: Adopts standardized terms, definitions, and measurement units referenced from related IEC and ISO standards to ensure uniformity across MEMS documentation.
Applications
IEC 62047-4:2008 is pivotal for manufacturers, developers, and quality assurance professionals involved in semiconductor MEMS, serving broad applications such as:
- MEMS Sensors: Enabling reliable specification and testing of accelerometers, gyroscopes, pressure sensors, and other microsensors critical to automotive, aerospace, consumer electronics, and industrial markets.
- RF MEMS Components: Supporting the development and qualification of MEMS used in radio-frequency circuits and communication devices.
- Process Standardization: Guiding process engineers to implement consistent micromachining and bonding techniques, crucial for scalable MEMS device fabrication.
- Quality Systems Integration: Aligning MEMS production with IECQ-CECC quality assessment frameworks, enhancing supplier qualification and product reliability.
- Cross-Material MEMS: Extending relevance to emerging MEMS technologies involving non-semiconductor materials such as polymers and ceramics, broadening innovation scope.
Related Standards
IEC 62047-4 is part of the comprehensive IEC 62047 series dedicated to micro-electromechanical devices and is closely linked to the following international standards:
- IEC 62047-1: Terms and definitions specific to micro-electromechanical devices, ensuring consistent language and conceptual clarity.
- IEC 60027 Series: Letter symbols used in electrical technology enabling uniform symbol usage in MEMS documentation.
- IEC 60068-2 Series: Environmental testing procedures that establish reliability test methods referenced in MEMS quality assessments.
- IEC 60747-1: General semiconductor device specifications, offering foundational standards applicable to MEMS device characteristics.
- IEC 60749 Series: Mechanical and climatic test methods tailored for semiconductor devices, adapted for MEMS testing scenarios.
- IEC 61193-2 & ISO 2859-1: Sampling plans and inspection methodologies to guide statistical sampling of MEMS devices during qualification.
- IEC QC 001002-3: IEC Quality Assessment System rules of procedure, facilitating MEMS qualification and capability approval processes.
By adhering to IEC 62047-4:2008 and its related standards, organizations can ensure the consistent performance, quality, and interoperability of MEMS devices within the global electronics ecosystem. This approach drives innovation while safeguarding reliability and compatibility across diverse MEMS applications worldwide.
Технические детали
- Технический комитет
- SC 47F - Micro-electromechanical systems
- SKU
- IEC 62047-4:2008
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