IEC 62137-1-1:2007

Overview

IEC 62137-1-1:2007 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test describes a standardized method to evaluate the mechanical endurance of solder joints for gull‑wing lead surface mount components. The test applies a controlled pull‑type mechanical stress (at a 45° angle to the board) after exposure to rapid temperature change to assess how thermal cycling affects the integrity of the solder joint between component leads and PCB lands.

Key topics and technical requirements

• Scope: Applicable to gull‑wing lead surface mount components; focuses on solder joint endurance under repeated temperature change.
• Pull strength definition: Maximum force required to break the lead‑to‑board joint when pulled at 45°.
• Test sequence: Mounting (flow or reflow soldering), pre‑conditioning, initial pull measurement, temperature cycling (per IEC 60068‑2‑14), recovery, and intermediate/final pull measurements.
• Pull test equipment: Tension testing machine, pulling tool/jig (designed to apply force at 45°), specimen fastener, and electronic recorder. Recorder accuracy required: better than ±1%.
• Pull speed and jig details: Pull speed and pulling–tool geometry are specified (see Annex A); pull speed must be realized by the tension tester.
• Microscopy: Optical microscope with ~50×–250× magnification and ~2000 lx illumination for joint inspection.
• Test substrate: Epoxide woven glass fiber copper‑clad laminate (general purpose), nominal thickness 1.6 mm ±0.20 mm, copper foil ~0.035 mm ±0.010 mm; land geometry per IEC 61188‑5‑5 or component supplier recommendations.
• Materials: Solder alloy, flux, and solder paste selection per relevant parts of IEC 61190 and IEC 61190‑1‑3; effects for lead‑free vs tin‑lead alloys highlighted.

Practical applications

• Validate and compare process robustness of flow and reflow soldering profiles for gull‑wing components.
• Assess the impact of temperature cycling on solder joint strength - important for automotive, industrial, telecom, and consumer electronics where thermal stress is common.
• Compare solder alloys (lead‑free vs SnPb) and attachment materials to inform assembly process and material selection.
• Support reliability qualification, failure analysis, and product specification limits (component mass, number of leads, and required attachment strength).

Who uses this standard

• Electronics assembly and reliability engineers
• Test laboratories and QA teams
• PCB designers and component manufacturers
• Procurement and compliance teams specifying assembly acceptance criteria

Related standards

• IEC 60068‑1, IEC 60068‑2‑14 (temperature change)
• IEC 60194 (terms/definitions)
• IEC 61188‑5‑5 (land/attachment requirements)
• IEC 61190 series (flux, solder paste, solder alloys)
• IEC 61249‑2‑7 (PCB base materials)

Keywords: IEC 62137-1-1:2007, pull strength test, gull‑wing lead, surface mounting technology, solder joint, temperature cycling, reflow soldering, flow soldering, lead‑free solder, printed wiring board.