IEC 62769-4:2015
Field Device Integration (FDI) - Part 4: FDI Packages
Field Device Integration (FDI) - Part 4: FDI Packages
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 167
- Дата публикации:
- 12 мая 2015 г.
- Издание:
- IEC IS 62769 edition 1 version 1
- ICS:
- 25.040.40
IEC 62769-4:2015 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
Abstract
Overview
IEC 62769-4:2015, titled "Field Device Integration (FDI) - Part 4: FDI Packages," is an International Electrotechnical Commission (IEC) standard that specifies the structure and components of FDI Packages. This standard is an integral part of the overall FDI architecture which is designed to enable seamless integration and interoperability of field devices within industrial automation systems. FDI Packages serve as standardized containers that bundle device descriptions, user interfaces, communication profiles, and related attachments to facilitate device management and configuration.
Похожие стандарты
Стандарты, упомянутые в описании