IEC 62899-202:2023

Overview - IEC 62899-202:2023 (Printed electronics - Conductive ink)

IEC 62899-202:2023 is the International Electrotechnical Commission standard that defines terms and specifies standard test methods for characterization and evaluation of conductive inks used in printed electronics. It covers measurement and reporting methods for both the ink formulation (additive processes) and the resulting conductive layers (including layers produced by subtractive processes). This second edition (2023) updates and refines definitions, adds a summary of test methods and introduces mechanical tests for conductive layers.

Key topics and technical requirements

The standard focuses on measurable properties and standardized test procedures to ensure consistent communication across the printed electronics supply chain. Key topics include:

• Definitions and terminology for conductive material, conductive ink and conductive layer - clarifying industry vocabulary.
• Atmospheric conditions and pre-conditioning for reliable, reproducible measurements.
• Ink composition & contents: solid content, non-volatile content, ash content, and foreign matter.
• Physical and handling properties: density, rheology (viscosity behavior), surface tension, particle/flake size of conductive materials, flashpoint, evaporation rate, and visual appearance.
• Electrical characterization of conductive layers: volume resistivity, surface resistivity (four-point probe and contactless methods), measurement specimen preparation and probe geometry considerations.
• Mechanical tests for conductive layers: bending/flex testing, abrasion resistance, and adhesion strength to substrates.
• Optical properties where applicable: transmittance, chromaticity, haze and refractive index for transparent conductive films.
• Storage, packaging and ageing: recommended storage conditions and methods for measuring aged deterioration, plus reporting templates for results.
• Informative annexes covering four-point probe examples, correction factors and the influence of specimen size/measurement position on resistance.

Practical applications

IEC 62899-202:2023 is intended to standardize how conductive inks and printed conductive layers are characterized so results are comparable between suppliers, manufacturers, test houses and end users. Typical practical uses:

• Qualification and R&D of conductive ink formulations (silver, copper, carbon-based inks).
• Process control and quality assurance for printed electronics manufacturing (inkjet, screen, gravure, flexo, etc.).
• Electrical performance verification for printed interconnects, antennas, RFID, sensors, heaters and transparent electrodes.
• Evaluation of mechanical robustness for flexible and wearable electronics.
• Test laboratories producing certified measurement reports for suppliers and OEMs.

Who should use this standard

• Conductive ink manufacturers and formulators
• Printed electronics OEMs and contract manufacturers
• Materials and process R&D teams
• Independent testing laboratories and certification bodies
• Procurement and quality assurance teams in electronics supply chains

Related standards

• IEC 62899-201: Materials - Substrates
• IEC 62899-203: Materials - Semiconductor ink
• IEC 62899-204: Materials - Insulator ink

Using IEC 62899-202:2023 helps align terminology, measurement practice and reporting across the printed electronics ecosystem, supporting reliable material selection and reproducible performance data.