IEC 62899-202-5:2018
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 15
- Дата публикации:
- 28 сентября 2018 г.
- Издание:
- IEC IS 62899 edition 1 version 1
- ICS:
- 31.180
IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
Abstract
Overview
IEC 62899-202-5:2018 defines a standardized mechanical bending test for evaluating the electrical behavior of a under repeated deformation. The standard describes the sliding-plate bending test method used in printed electronics to assess conductivity degradation and long-term reliability of conductive inks and printed conductive films.
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