IEC 62899-401:2017

Overview

IEC 62899-401:2017 - Printed electronics, Part 401: Printability – Overview - introduces the modular IEC 62899-4XX series that defines how to measure and specify printability in printed electronics. The standard frames requirements for the quality and reproducibility of printed patterns as the result of interactions between printing media, inks, substrates and environmental conditions. It sets the scope for measurement methods, analysis and compliance test methods, and environmental measuring techniques needed to produce comparable, reliable results across industry.

Key topics and requirements

• Modular structure: IEC 62899-401 explains the layout of the 4XX series and how future parts extend metrics and methods for printed electronics printability.
• Quality factors (shape and uniformity) are classified into:
  • Horizontal elements: pattern width, edge waviness, void (ink omission).
  • Vertical elements: thickness, surface roughness, surface profile.
• Measurements and reproducibility: The series specifies methods to measure these quality factors and establishes requirements for reproducibility of printed patterns produced by printing machines and plating processes.
• Basic patterns for evaluation: The standard requires defined basic patterns (straight, angular, circular lines) for assessing:
  • Printing machine accuracy
  • Plating resolution
  • Application-specific product performance
• Analysis and compliance test methods: Outlines the need for defined analysis procedures and pass/fail criteria to assess printability per application.
• Environmental conditions: Specifies that measuring methods for environmental conditions (humidity, temperature, etc.) must be provided to ensure valid, reproducible measurements.

Practical applications and users

IEC 62899-401 is intended for organizations involved in the design, production, testing and procurement of printed electronic components and devices:

• Printed electronics manufacturers and contract printers - for production control and process qualification.
• Materials suppliers (inks, substrates) - to validate compatibility and specification claims.
• OEMs and product designers - to set printability requirements for functional patterns and circuits.
• Test laboratories and conformity assessment bodies - to implement standardized measurement and compliance methods.
• R&D teams and process engineers - for benchmarking, process optimization and technology transfer. Practical benefits include improved comparability of results, enhanced reproducibility, smoother international trade, and clearer product specifications.

Related standards

IEC 62899-4XX series (selected parts):

• IEC 62899-402-1 to -6 - measurement methods (width, edge waviness, void, roughness, thickness, profile)
• IEC 62899-403-1 to -3 - reproducibility requirements (printing, plating, application patterns)
• IEC 62899-404 - analysis and compliance test methods
• IEC 62899-405 - environmental measurement methods

Other referenced standards in the bibliography: ISO 1004-2, ISO 2808, ISO 12635, ISO 17724, ISO/IEC TS 24790 - useful cross-references for related measurement and vocabulary topics.

Keywords: IEC 62899-401, printed electronics, printability, measurement methods, reproducibility, pattern quality, inks, substrates, compliance test methods.