ISO 20263:2017

Overview

ISO 20263:2017 - Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials - defines a standardized procedure to determine the averaged interface position between two layers in cross‑sectional images of multi‑layered materials. The method applies to images recorded with TEM or STEM and to elemental maps acquired with EDS or EELS, including digitized images from digital cameras, imaging plates or scanned photographic film. It is intended for practical thickness and interface evaluation (from a few nanometres to a few micrometres) and is explicitly not a substitute for atomic‑level multi‑slice simulation (MSS) methods.

Key Topics and Requirements

• Scope & applicability
  • Cross‑sectional TEM/STEM images and cross‑sectional elemental maps (EDS/EELS).
  • Digitized image formats from CCD/CMOS cameras, imaging plates or scanners.
  • Thickness range: from a few nm to a few μm.
• Specimen preparation
  • Cross‑section must be cut perpendicular to the layer stacking direction; cut angle required: 90° ± 6°.
  • Typical thinning techniques: ultra‑microtomy, ion milling, FIB thinning, etc.
• Image analysis workflow
  • Define a region of interest (ROI) in the cross‑sectional image.
  • Acquire an averaged intensity profile across the ROI (pixel intensity vs. distance).
  • Apply moving‑averaged and differential processing to the intensity profile to detect averaged interface position.
  • Use filtering/FFT as needed to manage noise and spatial frequency components.
• Uncertainty & calibration
  • Procedures for estimating uncertainty accumulated from specimen prep, imaging and image processing.
  • Pixel‑size calibration (Annex C) and recommendations for reporting measurement uncertainty.
• Limitations
  • Not intended for determining atomically simulated interface positions from MSS (multi‑slice simulation).

Applications and Who Uses It

• Materials scientists, electron microscopists, and metrology labs measuring layer thicknesses and interface flatness.
• Semiconductor manufacturing, coatings and thin‑film industries, sensor development, and R&D groups needing repeatable, quantitative interface location from TEM/STEM images.
• Useful for quality control, process verification, failure analysis and research where averaged interface position (not atomic registry) is required.

Related Standards

• ISO 15932:2013 (methods referenced for FFT/IFFT concepts)
• ISO 29301:2010 (definitions for digital imaging and detectors)
• Additional ISO/TC 202 microbeam analysis guidance and terminologies

Keywords: ISO 20263:2017, microbeam analysis, analytical electron microscopy, TEM, STEM, EDS, EELS, interface position, cross-sectional imaging, ROI, image processing, moving average, differential processing, layer thickness.